High-density mounting technologies are advancing in the midst of the continuous development of mobile and digital consumer electronics and automotives. Underfill use on the solder joints of semiconductor devices such as Fine Pitch BGA, WLCSP, Flip Chip is progressing every year to reduce thermal and mechanical stress to improve product reliability and life cycle. Sunstar develops and sells repairable stress reducing underfills of various grades. They offer mount reliability with the company’s underfills which possess a track record in a wide range of fields.

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