Within these past few years not only has there been an increase in number of tourists coming to Japan but there has been an increase in interest in the general Japanese public to market towards these tourists. Many newspapers and magazines articles have been written on how travel agencies, accommodations, restaurants, theme parks, tourist destinations, shops of all ranges in Japan are working together and hard to understand their new market, meet their needs, and find more potential.

Japanese locals in the more rural parts of Japan were less enthusiastic about opening up to foreign customers in the past, are now actively seeking consultation on how best to accommodate these new foreign customers coming from all over the globe.

New tours, services, products, signs, job positions have been created due to these changes in the industry and more is yet to come.

High-density mounting technologies are advancing in the midst of the continuous development of mobile and digital consumer electronics and automotives. Underfill use on the solder joints of semiconductor devices such as Fine Pitch BGA, WLCSP, Flip Chip is progressing every year to reduce thermal and mechanical stress to improve product reliability and life cycle. Sunstar develops and sells repairable stress reducing underfills of various grades. They offer mount reliability with the company’s underfills which possess a track record in a wide range of fields.

For more information on Sunstar Engineering, Inc., please refer to the Sunstar Engineering website or send an inquiry.