EP Silicone & Reworkable Underfill

SUNSTAR

EP Silicone & Reworkable Underfill

Sunstar Engineering, Inc.

Sunstar Engineering, Inc. Electronic Materials Related Activities.
High-density mounting technologies are advancing in the midst of the continuous development of mobile and digital consumer electronics and automotives. Underfill use on the solder joints of semiconductor devices such as Fine Pitch BGA, WLCSP , Flip Chip is progressing every year to reduce thermal and mechanical stress to improve product reliability and life cycle. At Sunstar,we develop and sell repairable stress reducing underfills of various grades. We offer mount reliability with our company's underfills which possess a track record in a wide range of fields.


Sunstar Engineering, Inc.

Sunstar Engineering, Inc. Company Overview
  • Founded:
    July 1954
    The first Sunstar Group company, Imperial Rubber Company, was founded in 1941.
  • Established:
    November 1950
  • Capital:
    3.1 billion 25 million yen (Fiscal Year 2003)
  • Headquarters:
    3-1 Asahi-machi, Takatsuki, Osaka 569-1134, Japan
    TEL: +81-(0) 72-681-0351 (rep)
  • Representatives:
    Sadaaki Nomura, Director, President and Representative Executive Officer
  • Number of Employees:
    316 (as of March 31, 2004)
  • Main Business:
    • Chemical Division
    • 1.Adhesives for electronic devices, underfills
    • 2.Construction adhesives and sealants
    • 3.Automotive adhesives and sealants
    • 4.Mechanical foam system
    • Motorcycle Division
    • 1.Motorcycle sprockets and brake discs
    • 2.Power assist unit, bicycles
  • Sales:
    (consolidated) 30.55 billion yen
  • Parent company
    Sunstar Inc.
  • Sunstar Engineering (China)

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Track Record by Field
  • Mobile Phone/PHS
     

    Sunstar Engineering, Inc.

  • Laptop
     

    Sunstar Engineering, Inc.

  • Car Navigator
     

    Sunstar Engineering, Inc.

  • Printer
     

    Sunstar Engineering, Inc.

  • Car Camera
     

    Sunstar Engineering, Inc.

  • Semiconductor
    Manufacturing Equipment

    Sunstar Engineering, Inc.

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Sunstar Core Technologies
Ep Silicone Underfill
Ep Silicone Underfill
SEM pix Ep silicone

Dispersed cross-linked silicone particle epoxy-based underfill
Reduces thermal and mechanical stress

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Reworkable Underfill

Reworkability

Absorbs drop shock with its low elasticity
Curable at 80c in around 7 minutes, simplifying the rework process

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Sunstar Engineering, Inc. Electronic Materials Main Clients

Telecom Sanyo, Tottori Sanyo Electronic, Telemec, Shinryoko, Dainichi Denshi, Fujitsu Mobile, Shimane Fujitsu, Mitsubishi Electric, OMRON, Fujitsu I-Network Systems, Hokubu Communication & Industrial, Ohyama Denki, Fujitsu General, Panasonic Automotive Systems, Sumitomo Wiring Systems, Solectron Ibaraki, Konica Minolta, TOTO, OpNext, Hitachi Media Electronics, etc.

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