Characteristics
- Cross-linked silicone particles dispersed in epoxy resin relieves stress from thermal and also mechanical shocks.
- Hard to crack
- It absorbs flux residue which allows for better filling underneath the device.
- Synergy between silicone and filler makes the CTE drop lower.With the same filler content(%), Ep silicone has lower CTE level than ordinary epoxy.
- Lower CTE works to relieve stress on a PCB in the process of curing.
Ep silicone sea island structure
SEM pix Ep silicone
Sunstar's original polymer technology innovated epoxy formulation
for electronics industry. This sea-island structure makes the epoxy
resin flexible and hard to crack. It absorbs stress from thermal
and mechanical shocks. All our UF materials are based on this unique structure.
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Characteristics
- Low temp. snap cure -- 500µm layer of the material takes only 1 second to gel at over 70 degrees
- Excellent reworkability allows for the easy wiping of the resin residue left on PCB.
- Excellent electrical insulation
- Excellent storage stability at 5~10c
- Excellent endurance for mechanical stress(bending stress)
- Elastic urethane protects solder interconnects from drop shocks.
- Allows for the use of various thermal treatment system
example: radio frequent dielectric heating system ultra sonic heating system)
Reworkability
Reworkability
Urethane based underfill, 991 series, eliminates the stressful
process of taking the underfilled CSP off and cleaning the material
residue off of the PCB. The underfill chemically dissolves after
a heat treatment and allows for an easy wiping of little residue
left on the PCB, which makes it possible for engineers to analyze
a defect device and also to save expensive PCBs.
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